Semiconductor memory device and semiconductor memory manufacturing apparatus

ABSTRACT

A first memory device includes a first magnetoresistive cell having a plurality of deposition layers. A second memory device includes a second magnetoresistive cell having a plurality of deposition layers. Each of the plurality of deposition layers of the second magnetoresistive cell corresponds to one of the plurality of deposition layers of the first magnetoresistive cell. One of the plurality of deposition layers of the second magnetoresistive cell is thinner than a corresponding deposition layer of the plurality of deposition layers of the first magnetoresistive cell.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. application Ser. No. 15/871,922, filed on Jan. 15, 2018, which claims the benefit under 35 U.S.C. § 119 to Korean Patent Application No. 10-2017-0100525, filed on Aug. 8, 2017, in the Korean Intellectual Property Office (KIPO), the disclosure of each of which is incorporated by reference herein in its entirety.

TECHNICAL FIELD

The present inventive concept relates to a semiconductor memory device and a semiconductor memory manufacturing apparatus.

DISCUSSION OF RELATED ART

Magnetic memory devices include a magnetic tunnel junction (MTJ). The MTJ includes two magnetic layers and an insulating layer located between the magnetic layers. The MTJ has a resistance value that varies according to magnetization directions of the two magnetic layers. The resistance value of the MTJ increases when the magnetization directions of the two magnetic layers are opposite to each other, and decreases when the magnetization directions of the two magnetic layers are parallel to each other. Data are written to or read from the magnetic memory devices using a difference between resistance values of the MTJ according to the magnetization directions of the two magnetic layers.

SUMMARY

According to an exemplary embodiment of the present inventive concept, a semiconductor memory device is provided as follows. A first memory device includes a first magnetoresistive cell having a plurality of deposition layers. A second memory device includes a second magnetoresistive cell having a plurality of deposition layers. Each of the plurality of deposition layers of the second magnetoresistive cell corresponds to one of the plurality of deposition layers of the first magnetoresistive cell. One of the plurality of deposition layers of the second magnetoresistive cell is thinner than a corresponding deposition layer of the plurality of deposition layers of the first magnetoresistive cell.

According to an exemplary embodiment of the present inventive concept, a semiconductor memory device is provided as follows. A first memory device that is located in a first memory area includes a first magnetoresistive cell. A second memory device that located in a second memory area includes a second magnetoresistive cell. The first memory device has a higher operating speed and a lower retention characteristic than the second memory device.

According to an exemplary embodiment of the present inventive concept, a semiconductor memory manufacturing apparatus is provided as follows. A wafer holder supports a semiconductor wafer. A sputtering target holder is obliquely located above the wafer holder. A shielding plate is interposed between the sputtering target holder and the wafer holder. The shielding plate includes a first exposure area and a second exposure area. The first exposure area is larger than the second exposure area.

BRIEF DESCRIPTION OF DRAWINGS

These and other features of the present inventive concept will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings of which:

FIG. 1 is a schematic block diagram of a semiconductor memory device according to an exemplary embodiment of the present inventive concept;

FIG. 2 shows longitudinal sectional views of memory devices formed in a first memory area and a second memory area of FIG. 1;

FIG. 3 is a graph illustrating a switching voltage (V_(SW)) measured according to a thickness of a capping layer of each of the memory devices constituting the semiconductor memory device according to the exemplary embodiment of the present inventive concept;

FIG. 4 is a graph illustrating thermal stability measured according to the thickness of the capping layer of each of the memory devices constituting the semiconductor memory device according to the exemplary embodiment of the present inventive concept;

FIG. 5 is a longitudinal sectional view of a semiconductor memory device according to an exemplary embodiment of the present inventive concept;

FIG. 6 is a longitudinal sectional view of a semiconductor memory device according to an exemplary embodiment of the present inventive concept;

FIG. 7 is a longitudinal sectional view of a semiconductor memory device according to an exemplary embodiment of the present inventive concept;

FIGS. 8A to 8I are longitudinal sectional views for describing a process of manufacturing a semiconductor memory device according to an exemplary embodiment of the present inventive concept;

FIG. 9 is a longitudinal sectional view of a semiconductor memory manufacturing apparatus according to an exemplary embodiment of the present inventive concept;

FIG. 10 is a plan view of a semiconductor wafer deposited by the semiconductor memory manufacturing apparatus according to the exemplary embodiment of the present inventive concept;

FIG. 11A is a plan view of a shielding plate of FIG. 9, FIG. 11B is an enlarged view of area A of FIG. 11A, and FIG. 11C is a longitudinal sectional view taken along line B-B of FIG. 11B;

FIG. 12 is a top view illustrating a shielding plate after the semiconductor wafer of FIG. 10 is mounted on a wafer holder;

FIG. 13A is a plan view of a shielding plate according to an exemplary embodiment of the present inventive concept, and FIG. 13B is an enlarged view of area C of FIG. 13A; and

FIG. 14 is a partial longitudinal sectional view illustrating an operation of the shielding plate of the semiconductor memory manufacturing apparatus of FIG. 9.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, semiconductor memory devices and an apparatus for manufacturing the same according to exemplary embodiments of the present inventive concept will be described.

First, a semiconductor memory device according to an exemplary embodiment of the present inventive concept will be described.

FIG. 1 is a schematic block diagram of a semiconductor memory device according to an exemplary embodiment of the present inventive concept, and FIG. 2 shows longitudinal sectional views of memory devices formed in a first memory area and a second memory area of FIG. 1.

Referring to FIGS. 1 and 2, a semiconductor memory device 100 includes a substrate 110, a lower insulating layer 120, lower contact plugs 130, a first memory device 140, a second memory device 150, an upper insulating layer 160, and upper contact plugs 170. The semiconductor memory device 100 further includes a bit line 180.

The semiconductor memory device 100 includes a first memory area 100 a, a second memory area 100 b, and a logic area 100 c. The semiconductor memory device 100 further includes a radio frequency (RF) area 100 d.

The semiconductor memory device 100 may be formed as a semiconductor memory device having various structures including the first memory area 100 a and the second memory area 100 b. The semiconductor memory device 100 may be formed as one separate memory chip. The semiconductor memory device 100 may be used as a system on chip (SoC). The semiconductor memory device 100 may be formed as a SoC including a RF function in the RF area 100 d. In this case, the semiconductor memory device 100 may be formed to include a memory such as a static random access memory (SRAM) or a dynamic random access memory (DRAM), of which an operating speed or a switching speed is important, and a memory such as a flash memory of which a retention characteristic is important.

The first memory device 140 is located in the first memory area 100 a and the second memory device 150 is located in the second memory area 100 b. The first memory device 140 has a low retention characteristic and operates with relatively small energy to have a high operating speed. For example, the first memory device 140 has the same or similar characteristics as or to an SRAM or a DRAM. The second memory device 150 operates with relatively large energy to have a low operating speed and has a high retention characteristic. For example, the second memory device 150 has the same or similar characteristics as or to a flash memory. The first memory device 140 may mainly transmit and receive data in conjunction with a logic circuit, and may temporarily store received data. The second memory device 150 may mainly transmit and receive data in conjunction with the first memory device 140, and may store received data.

The first memory device 140 and the second memory device 150 each includes a magnetoresistive cell including a magnetic tunnel junction (MTJ). The magnetoresistive cell may be formed of a plurality of deposition layers. The first memory device 140 and the second memory device 150 have each the same stacked structure. Since a thickness of any one deposition layer of the plurality of deposition layers of the magnetoresistive cell of the first memory device 140 is different from a thickness of any one deposition layer of the plurality of deposition layers of the magnetoresistive cell of the second memory device 150, the first memory device 140 and the second memory device 150 may have different characteristics. The first memory device 140 and the second memory device 150 may be simultaneously formed by one process. The first memory device 140 and the second memory device 150 may be formed by depositing any one deposition layer thereof with different thicknesses in a deposition process performed by a semiconductor memory manufacturing apparatus of FIG. 9 described below. In an exemplary embodiment, each of the deposition layers of the magnetoresistive cell of the second memory device 150 may correspond to one of the deposition layers of magnetoresistive cell of the first memory device 140.

The logic area 100 c is located between the first memory area 100 a and the second memory area 100 b. The first memory area 100 a and the second memory area 100 b are located opposite sides of the logic area 100 c. The logic area 100 c may include a circuit for controlling overall operations of the semiconductor memory device 100. The logic area 100 c may be formed to control various operations required in the semiconductor memory device 100.

The RF area 100 d may include various circuits for transmitting and receiving RE The RF area 100 d may be formed to control communication required in the semiconductor memory device 100.

The substrate 110 may be formed of a material having a semiconductor characteristic. The substrate 110 may be a silicon wafer, a silicon (Si) single crystalline substrate, a germanium (Ge) single crystalline substrate, a silicon-germanium (SiGe) single crystalline substrate, or a silicon on insulator (SOI) substrate. The substrate 110 may be a substrate in which the first memory area 100 a and the second memory area 100 b are integrally formed.

The lower insulating layer 120 may be formed of an insulating material.

The lower insulating layer 120 may be formed of silicon oxide, silicon nitride, or silicon oxynitride. The lower insulating layer 120 covers the substrate 110. For example, the lower insulating layer 120 may cover entirely an upper surface of the substrate 110. The lower insulating layer 120 is integrally formed over the first memory area 100 a and the second memory area 100 b. The lower insulating layer 120 may be formed in the first memory area 100 a and the second memory area 100 b by one process.

The lower contact plugs 130 may be formed of an electrically conductive material. The lower contact plugs 130 may be formed of a conductor such as polysilicon, a metal material, a metal silicide, or a metal nitride. The lower contact plugs 130 vertically pass through the lower insulating layer 120 to be in contact with an upper surface of the substrate 110. The lower contact plugs 130 are formed in each of the first memory area 100 a and the second memory area 100 b, and the number of the lower contact plugs 130 may be equal to a sum of the number of the first memory devices 140 and the number of the second memory devices 150.

The first memory device 140 may include a first lower electrode 141, a first fixed layer 142, a first tunnel barrier layer 143, a first free layer 144, a first capping layer 145, and a first upper electrode 146. The first fixed layer 142, the first tunnel barrier layer 143, and the first free layer 144 may form an MTJ. The first fixed layer 142, the first tunnel barrier layer 143, the first free layer 144, and the first capping layer 145 may be sequentially stacked from a bottom to a top to form a first magnetoresistive cell of the first memory device 140. The first magnetoresistive cell may be electrically connected to the first lower electrode 141. The first magnetoresistive cell may be electrically connected to the first upper electrode 146. In the first magnetoresistive cell, additional layers may be formed between the first fixed layer 142, the first tunnel barrier layer 143, the first free layer 144, and the first capping layer 145.

The first memory device 140 may further include a liner (not illustrated) which surrounds a side surface of the first magnetoresistive cell. The first lower electrode 141, the first fixed layer 142, the first tunnel barrier layer 143, the first free layer 144, the first capping layer 145, and the first upper electrode 146 constituting the first memory device 140 may be arranged so that side surfaces thereof are vertically aligned with each other. The first memory device 140 in plural may be formed in the first memory area 100 a.

The first lower electrode 141 may include a conductive material such as polysilicon, a metal, a metal alloy, or a metal silicide. The first lower electrode 141 may include a conductive metal nitride such as titanium nitride or tantalum nitride. The first lower electrode 141 may be formed on the lower insulating layer 120 to have a plate shape having a predetermined thickness and area. The first lower electrode 141 may be electrically connected to the lower contact plug 130.

The first fixed layer 142 may include CoFeB, CoFe, CoFeTb, CoFeDy, CoFeGd, CoPt, CoFePt, or FeB. The first fixed layer 142 may be formed as a single layer or a double layer. The first fixed layer 142 may be formed as a multilayer. For example, the first fixed layer 142 includes a first lower fixed layer 142 a, a first exchange fixed layer 142 b, and a first upper fixed layer 142 c. The first fixed layer 142 may further include a seed layer (not illustrated).

The first fixed layer 142 may be formed to be deposited on an upper surface of the first lower electrode 141. The first fixed layer 142 may have a magnetization direction perpendicular to the upper surface of the substrate 110. The magnetization direction of the first fixed layer 142 may be fixed without being influenced by an external magnetic field. The magnetization direction of the first fixed layer 142 may be fixed without being influenced by a magnetic field formed between the first upper electrode 146 and the first lower electrode 141.

The seed layer may include tantalum (Ta) or ruthenium (Ru). The seed layer may be formed as a single layer or a double layer. For example, the seed layer may be formed as a single layer including tantalum (Ta) or ruthenium (Ru). The seed layer may be formed as a double layer including a tantalum (Ta) layer located at a lower portion thereof and a ruthenium (Ru) layer located at an upper portion of the tantalum (Ta) layer. The seed layer may be formed to be deposited on the upper surface of the first lower electrode 141. The seed layer may determine the crystallinity or crystalline orientation of the first lower fixed layer 142 a.

The first lower fixed layer 142 a may include CoPt, CoPd, FePt, FePd, CoFeTb, CoFeDy, or CoFeGd. The first lower fixed layer 142 a may be formed as a single layer or a double layer. For example, the first lower fixed layer 142 a may be formed as a single layer of a cobalt-platinum (CoPt) layer or a cobalt-palladium (CoPd) layer. The first lower fixed layer 142 a may be formed as a double layer in which a cobalt-platinum (CoPt) layer and a cobalt-palladium (CoPd) layer are stacked. The first lower fixed layer 142 a may have a magnetization direction perpendicular to the upper surface of the substrate 110. The first lower fixed layer 142 a may be formed to be deposited on an upper surface of the seed layer. The magnetization direction of the first lower fixed layer 142 a may be fixed without being influenced by an external magnetic field. The magnetization direction of the first lower fixed layer 142 a may be fixed without being influenced by the magnetic field formed between the first upper electrode 146 and the first lower electrode 141.

The first exchange fixed layer 142 b may be formed as a synthetic anti-ferromagnetic (SAF) layer. The first exchange fixed layer 142 b may include an anti-ferromagnetic metal such as ruthenium (Ru), iridium (Ir), or rhodium (Rh). The first exchange fixed layer 142 b may be formed to be deposited on an upper surface of the first lower fixed layer 142 a.

The first upper fixed layer 142 c may include CoFeB, CoFeTa, CoFeTb, CoFeDy, CoFeGd, CoFePt, CoFe, CoPt, or FeB. The first upper fixed layer 142 c may be formed as a single layer or a multilayer. The first upper fixed layer 142 c may include a cobalt-iron-boron (CoFeB) layer/a tantalum (Ta) layer/a cobalt-iron-boron (CoFeB) layer. The first upper fixed layer 142 c may be formed to have a multi-layered structure including a cobalt (Co) layer/a boron (B) layer/a cobalt-iron-boron (CoFeB) layer or a cobalt (Co) layer/a tungsten (W) layer/a cobalt-iron-boron (CoFeB) layer/a tungsten (W) layer/a cobalt-iron-boron (CoFeB) layer. The first upper fixed layer 142 c may be formed to be deposited on an upper surface of the first exchange fixed layer 142 b. The first upper fixed layer 142 c may have a magnetization direction perpendicular to the upper surface of the substrate 110. The magnetization direction of the first upper fixed layer 142 c may be fixed without being influenced by an external magnetic field. The magnetization direction of the first upper fixed layer 142 c may be fixed without being influenced by the magnetic field formed between the first upper electrode 146 and the first lower electrode 141.

The first tunnel barrier layer 143 may include a magnesium (Mg) oxide film. The first tunnel barrier layer 143 may include a titanium (Ti) oxide film, an aluminum (Al) oxide film, a magnesium-zinc (Mg—Zn) oxide film, or a magnesium-boron (Mg—B) oxide film. The first tunnel barrier layer 143 may be formed by depositing a metal and then oxidizing the metal. For example, the first tunnel barrier layer 143 may be formed by depositing and then oxidizing magnesium (Mg) on an upper surface of the first upper fixed layer 142 c. The first tunnel barrier layer 143 may be located between the first fixed layer 142 having ferromagnetism and the first free layer 144. When a voltage is applied in a direction perpendicular to a bonding surface of the first tunnel barrier layer 143 to each of the first fixed layer 142 and the first free layer 144, a current may flow through the MTJ due to a tunnel effect. A resistance value of the MTJ may be lowered when spin polarization of the first fixed layer 142 has the same direction as that of the first free layer 144, and may be increased when the spin polarization of the first fixed layer 142 has an opposite direction to that of the first free layer 144.

The first free layer 144 may include CoFeB, FeB, CoFe, or Co₂FeSi. The first free layer 144 may be formed as a single layer or a multilayer. For example, the first free layer 144 may be formed as a single layer of a cobalt-iron-boron (CoFeB) layer. The first free layer 144 may be formed as a multilayer including a cobalt-iron-boron (CoFeB) layer/a tungsten (W) layer/a cobalt-iron-boron (CoFeB) layer. The first free layer 144 may be formed to be deposited on an upper surface of the first tunnel barrier layer 143. The first free layer 144 may have a magnetization direction perpendicular to the upper surface of the substrate 110. The magnetization direction of the first free layer 144 may be changed. For example, the magnetization direction of the first free layer 144 may be changed by influence of the magnetic field formed between the first upper electrode 146 and the first lower electrode 141.

The first capping layer 145 may include tantalum (Ta), magnesium (Mg), or titanium (Ti). The first capping layer 145 may include copper (Cu), aluminum (Al), or ruthenium (Ru). The first capping layer 145 may be formed with a metal oxide film by an oxidation process after a metal film is deposited by a sputtering process. The first capping layer 145 may be formed on an upper surface of the first free layer 144 to have a first capping thickness t1. The first capping thickness t1 may range from 0.7 nm to 1.5 nm. The first capping thickness t1 of the first capping layer 145 may be adjusted by adjusting a thickness of a sputtered metal. The first capping thickness t1 may affect energy required to change the magnetization direction of the first free layer 144 included in the MTJ. When the first capping thickness t1 is thick, the energy required to change the magnetization direction of the MTJ is reduced, and thus the operating speed thereof may be increased and the retention characteristic thereof may be reduced. When the first capping thickness t1 is thin, the energy required to change the magnetization direction of the MTJ is increased, and thus the operating speed thereof may be reduced and the retention characteristic thereof may be increased. The first capping thickness t1 of the first capping layer 145 may be formed to be relatively thick. In this case, the operating speed of the first magnetoresistive cell may be relatively high, and the retention characteristic thereof may be low.

The first upper electrode 146 may be formed of a conductor such as a metal material or a metal silicide. The first upper electrode 146 may be formed to be deposited on an upper surface of the first capping layer 145.

The second memory device 150 includes a second lower electrode 151, a second fixed layer 152, a second tunnel barrier layer 153, a second free layer 154, a second capping layer 155, and a second upper electrode 156. The second memory device 150 in plural may be formed in the second memory area 100 b. The second fixed layer 152, the second tunnel barrier layer 153, the second free layer 154, and the second capping layer 155 of the second memory device 150 may form a second magnetoresistive cell of the second memory device 150. The second magnetoresistive cell may be electrically connected to the second lower electrode 151. The second magnetoresistive cell may be electrically connected to the second upper electrode 156. In the second magnetoresistive cell, additional layers may be formed between the second fixed layer 152, the second tunnel barrier layer 153, the second free layer 154, and the second capping layer 155.

The second memory device 150 may be formed to have the same stacked structure as the first memory device 140, and may be simultaneously formed with the first memory device 140 by one process. The second lower electrode 151, the second fixed layer 152, the second tunnel barrier layer 153, the second free layer 154, the second capping layer 155, and the second upper electrode 156 of the second memory device 150 may be formed of the same materials as the first lower electrode 141, the first fixed layer 142, the first tunnel barrier layer 143, the first free layer 144, the first capping layer 145, and the first upper electrode 146 of the first memory device 140. The second memory device 150 may be formed to have the same stacked structure as the first memory device 140. Therefore, detailed descriptions of the second lower electrode 151, the second fixed layer 152, the second tunnel barrier layer 153, the second free layer 154, the second capping layer 155, and the second upper electrode 156 of the second memory device 150 will be omitted.

However, at least one deposition layer included in the second magnetoresistive cell of the second memory device 150 may be formed to have a thickness different from that of the corresponding deposition layer of the first magnetoresistive cell of the first memory device 140. A thickness of any one deposition layer of the second magnetoresistive cell may be thinner than a thickness of a corresponding deposition layer of the first magnetoresistive cell. For example, the second capping layer 155 with a second capping thickness is thinner than the first capping layer 145 with the first capping thickness t1. The second capping thickness t2 of the second capping layer 155 may range from 0.1 nm to 0.7 nm. The second capping thickness t2 of the second capping layer 155 may be relatively thinner than the first capping thickness t1 of the first capping layer 145. In this case, an operating speed of the second magnetoresistive cell may be low, and a retention characteristic thereof may be high.

FIG. 3 is a graph illustrating a switching voltage V_(SW) measured according to a thickness of a capping layer of each of the memory devices constituting the semiconductor memory device according to the exemplary embodiment of the present inventive concept. In FIG. 3, an X-axis represents a thickness of the capping layer, and the thickness of the capping layer is increased in a right direction. The switching voltage V_(SW) of a memory device is reduced as the thickness of the capping layer is increased, and is increased as the thickness of the capping layer is reduced. FIG. 4 is a graph illustrating thermal stability measured according to the thickness of the capping layer of each of the memory devices constituting the semiconductor memory device according to the exemplary embodiment of the present inventive concept. In FIG. 4, an X-axis represents a thickness of the capping layer, and the thickness of the capping layer is increased in the right direction. The thermal stability in a memory device is reduced as the thickness of the capping layer is increased, and is increased as the thickness of the capping layer is reduced. Thermal stability may affect a retention characteristic of the memory device.

Therefore, when the thickness of the capping layer is thicker, the memory device may have characteristics like an SRAM of which an operating speed or a switching speed is increased and a retention characteristic is reduced. Further, when the thickness of the capping layer is thinner, the memory device may have characteristics like a flash memory of which an operating speed is reduced and a retention characteristic is increased.

Referring back to FIG. 2, the upper insulating layer 160 is formed on the lower insulating layer 120 to surround the first memory device 140 and the second memory device 150. The upper insulating layer 160 may be formed of silicon oxide.

The upper contact plugs 170 vertically pass through the upper insulating layer 160, and thus lower ends of the upper contact plugs 170 are be in contact with the first memory device 140 and the second memory device 150. For example, the upper contact plugs 170 may be electrically connected to the first memory device 140 and the second memory device 150. The upper contact plugs 170 may be electrically connected to the first upper electrode 146 and the second upper electrode 156, and upper ends of the upper contact plugs 170 may be exposed at an upper surface of the upper insulating layer 160. The upper contact plugs 170 may be formed of a conductor such as polysilicon, a metal material, and a metal silicide. On the other hand, when the first upper electrode 146 or the second upper electrode 156 is in contact with the bit line 180, the upper contact plug 170 may be omitted. The bit line 180 is formed on the upper surface of the upper insulating layer 160, and connected to the upper contact plugs 170. The bit line 180 may be formed of a conductor such as polysilicon, a metal material, and a metal silicide.

Next, semiconductor memory devices according to exemplary embodiments of the present inventive concept will be described.

Hereinafter, the same reference numerals are assigned to the same components of the semiconductor memory devices according to the exemplary embodiments of the present inventive concept as those of the semiconductor memory device according to an exemplary embodiment of the present inventive concept, detailed descriptions thereof will be omitted, and different components therefrom will be mainly described.

FIG. 5 is a longitudinal sectional view of a semiconductor memory device according to an exemplary embodiment of the present inventive concept.

Referring to FIG. 5, a semiconductor memory device 200 includes a substrate 110, a lower insulating layer 120, lower contact plugs 130, a first memory device 240, a second memory device 250, an upper insulating layer 160, and upper contact plugs 170. The semiconductor memory device 200 further includes a bit line 180.

A first magnetoresistive cell of the first memory device 240 has a reversed stacked structure from that of the first magnetoresistive cell of FIGS. 1 and 2. For example, the first memory device 240 has a structure in which a first capping layer 145, a first free layer 144, a first tunnel barrier layer 143, and a first fixed layer 142 are sequentially stacked from the substrate 110. Further, a second magnetoresistive cell of the second memory device 150 has a reversed stacked structure from that of the second magnetoresistive cell of FIGS. 1 and 2. For example, the second memory device 250 has a structure in which a second capping layer 155, a second free layer 154, a second tunnel barrier layer 153, and a second fixed layer 152 are sequentially stacked from the substrate 110.

FIG. 6 is a longitudinal sectional view of a semiconductor memory device according to an exemplary embodiment of the present inventive concept.

Referring to FIG. 6, a semiconductor memory device 300 includes a substrate 310, a lower insulating layer 120, lower contact plugs 130, a switching device 390, a first memory device 140, a second memory device 150, an upper insulating layer 160, and upper contact plugs 170. The semiconductor memory device 300 further includes a bit line 180 and word lines 385.

The substrate 310 includes a source area 311 and a drain area 312. The source area 311 and the drain area 312 are spaced a predetermined distance from each other. The source area 311 and the drain area 312 may be formed by doping with a dopant such as boron, phosphorus, or arsenic. The word line 385 may be electrically connected to the source area 311. The lower contact plug 130 may be electrically connected to the drain area 312.

The switching device 390 may be formed to have a gate structure. The switching device 390 includes a gate insulating layer 391, a gate electrode 392, a gate capping layer 393, and a gate spacer 394. The switching device 390 is located between the source area 311 and the drain area 312 on an upper surface of the substrate 310.

The gate insulating layer 391 may include silicon oxide, silicon nitride, or a high dielectric. The gate insulating layer 391 is formed between the source area 311 and the drain area 312 on the upper surface of the substrate 310. The gate electrode 392 may include a conductor such as polysilicon doped with an impurity, a metal, a metal alloy, or a metal silicide. The gate electrode 392 is formed on an upper surface of the gate insulating layer 391. The gate capping layer 393 may include an insulator such as silicon oxide or silicon nitride. The gate capping layer 393 is formed on an upper surface of the gate electrode 392. The gate spacer 394 may be formed of silicon nitride or silicon oxide. The gate spacer 394 covers side surfaces of the gate insulating layer 391, the gate electrode 392, and the gate capping layer 393. The gate spacer 394 also covers a portion of an upper surface of each of the source area 311 and the drain area 312 which are located at both sides of the gate insulating layer 391.

The word line 385 includes a word contact plug 386 and a word electrode 387. The word contact plug 386 vertically passes through the lower insulating layer 120 to be in contact with the source area 311. An upper end of the word contact plug 386 is exposed at an upper surface of the lower insulating layer 120. The word contact plug 386 may be formed of the same material as the lower contact plug 130. The word electrode 387 may be electrically connected to the word contact plug 386 on the upper surface of the lower insulating layer 120. The word electrode 387 may extend in a lateral direction. The word electrode 387 may include polysilicon, a metal, a metal alloy, or a metal silicide.

FIG. 7 is a longitudinal sectional view of a semiconductor memory device according to an exemplary embodiment of the present inventive concept.

Referring to FIG. 7, a semiconductor memory device 400 includes a substrate 110, a lower insulating layer 120, lower contact plugs 130, a switching device 490, a first memory device 140, a second memory device 150, an upper insulating layer 160, and upper contact plugs 170. The semiconductor memory device 400 further includes a bit line 180 and a word line 485.

The switching device 490 may include a diode. For example, the switching device 490 includes an anode 491 and a cathode 492. The switching device 490 may be coupled to a middle portion of the lower contact plug 130.

The word line 485 may include a word electrode. The word line 485 is located between the substrate 110 and the lower contact plug 130. An upper surface of the word line 485 is in contact with the lower contact plug 130, and a lower surface thereof may be in contact with the substrate 110. The word line 485 is located on an upper surface of the substrate 110. The present inventive concept is not limited thereto. For example, the word line 485 may be embedded in the substrate 110. The word line 485 may extend in a lateral direction. The word line 485 may include polysilicon, a metal, a metal alloy, or a metal silicide.

Next, a process of manufacturing a semiconductor memory device according to an exemplary embodiment of the present inventive concept will be described.

FIGS. 8A to 8I are longitudinal sectional views for describing a process of manufacturing a semiconductor memory device according to an exemplary embodiment of the present inventive concept.

Hereinafter, a case in which a thickness of a first capping layer 145 is different from that of a second capping layer 155 in the semiconductor memory device according to the exemplary embodiment of the present inventive concept will be mainly described. The following processes may be applied even when a thickness of a first fixed layer 142 is different from that of a second fixed layer 152, even when a thickness of a first tunnel barrier layer 143 is different from that of a second tunnel barrier layer 153, or even when a thickness of a first free layer 144 is different from that of a second free layer 154.

Referring to FIG. 8A, a lower insulating layer 120 is formed on an upper surface of a substrate 110 to have a predetermined thickness. The lower insulating layer 120 may be formed as a single layer or a multilayer. A lower through hole 120 a is formed in the lower insulating layer 120 to vertically pass therethrough. A lower contact plug 130 is formed in the lower through hole 120 a. A lower end of the lower contact plug 130 is connected to the substrate 110, and an upper end thereof is exposed at an upper surface of the lower insulating layer 120. The substrate 110 may be formed with a silicon wafer. The lower insulating layer 120 may be formed of silicon oxide. The lower contact plug 130 may be formed of doped silicon, polysilicon, a metal, or a metal alloy.

Referring to FIG. 8B, a lower electrode film 141 a and a fixed film 142 d are formed on the upper surface of the lower insulating layer 120. The lower electrode film 141 a may be simultaneously formed in a first memory area 100 a and a second memory area 100 b by one process. The fixed film 142 d may be simultaneously formed in the first memory area 100 a and the second memory area 100 b by one process. The fixed film 142 d may be formed with three layers, but is illustrated herein as one layer. The lower electrode film 141 a may be formed to have the same thickness in the first memory area 100 a and the second memory area 100 b. The fixed film 142 d may be formed to have the same thickness in the first memory area 100 a and the second memory area 100 b. The lower electrode film 141 a may be formed of a conductive metal nitride such as titanium nitride or tantalum nitride. The lower electrode film 141 a may be formed by a sputtering process. The fixed film 142 d may be formed of CoFeB. The fixed film 142 d may be formed by a sputtering process.

Referring to FIG. 8C, a tunnel barrier film 143 a is formed on an upper surface of the fixed film 142 d. The tunnel barrier film 143 a may be simultaneously formed in the first memory area 100 a and the second memory area 100 b by one process. The tunnel barrier film 143 a may be formed with a magnesium oxide film. The tunnel barrier film 143 a may be formed by oxidizing a magnesium metal layer deposited on the upper surface of the fixed film 142 d. The tunnel barrier film 143 a may be formed to have the same thickness in the first memory area 100 a and the second memory area 100 b. The tunnel barrier film 143 a may be formed by a sputtering process.

Referring to FIG. 8D, a free film 144 a is formed on an upper surface of the tunnel barrier film 143 a. The free film 144 a may be simultaneously formed in the first memory area 100 a and the second memory area 100 b by one process. The free film 144 a may be formed to have the same thickness in the first memory area 100 a and the second memory area 100 b. The free film 144 a may be formed of CoFeB. The free film 144 a may be formed by a sputtering process.

Referring to FIG. 8E, a capping film 145 a is formed on an upper surface of the free film 144 a. The capping film 145 a may be simultaneously formed in the first memory area 100 a and the second memory area 100 b by one process. The capping film 145 a may be formed by a sputtering process. The capping film 145 a is formed to have different thicknesses in the first memory area 100 a and the second memory area 100 b. To this end, a shielding plate 17 (see FIGS. 11A to 11C) may be located above the free film 144 a during the sputtering process. The shielding plate 17 may include a first exposure area 18 a located above the first memory area 100 a and a second exposure area 18 b located above the second memory area 100 b. A first exposure hole 19 a may be entirely formed in the first exposure area 18 a, and a plurality of second exposure holes 19 b having a predetermined size may be formed in the second exposure area 18 b to have a grid shape or a stripe shape. Since the entire upper surface of the free film 144 a is exposed by the first exposure hole 19 a in the first memory area 100 a, sputtered particles may directly reach the upper surface of the free film 144 a. Since the upper surface of the free film 154 a is partially shielded by the second exposure holes 19 b in the second memory area 100 b, some sputtered particles may be blocked. Therefore, an amount of the sputtered particles deposited on the upper surface of the free film 154 a in the second memory area 100 b may be reduced and the free film 154 a in the second memory area 100 b may be formed to have a relatively thin thickness. A thickness of the capping film 145 a in the first memory area 100 a may be thicker than that of the capping film 145 a in the second memory area 100 b.

Referring to FIG. 8F, an upper electrode film 146 a is formed on an upper surface of the capping film 145 a. The upper electrode film 146 a may be simultaneously formed in the first memory area 100 a and the second memory area 100 b by one process. The upper electrode film 146 a may be formed to have the same thickness in the first memory area 100 a and the second memory area 100 b.

Referring to FIG. 8G, in each of the first memory area 100 a and the second memory area 100 b, a hard mask 146 b is formed on the upper electrode film 146 a. The hard mask 146 b may be formed of a metal. The hard mask 146 b may be formed to have an area corresponding to a plane area of each of a first magnetoresistive cell and a second magnetoresistive cell.

Referring to FIG. 8H, a first memory device 140 and a second memory device 150 may be formed by etching the lower electrode film 141 a, the fixed film 142 d, the tunnel barrier film 143 a, the free film 144 a, the capping film 145 a, and the upper electrode film 146 a using the hard mask 146 b as an etch mask. The first memory device 140 is formed in the first memory area 100 a, and the second memory device 150 is formed in the second memory area 100 b.

Referring to FIG. 8I, an upper insulating layer 160 is formed to cover the first memory device 140 and the second memory device 150. The upper insulating layer 160 covers the upper surface of the lower insulating layer 120 and side surfaces and an upper surface of each of the first memory device 140 and the second memory device 150. An upper through hole 160 a is formed in the upper insulating layer 160 to vertically pass therethrough. An upper contact plug 170 is formed in the upper through hole 160 a. A lower end of the upper contact plug 170 is connected to a first upper electrode 146 or a second upper electrode 156, and an upper end thereof is exposed at an upper surface of the upper insulating layer 160. The upper insulating layer 160 may be formed of silicon oxide. The upper contact plug 170 may be formed of polysilicon, a metal, or a metal alloy. A bit line 180 is formed on the upper surface of the upper insulating layer 160 to be electrically connected to the upper contact plug 170.

Next, a semiconductor memory manufacturing apparatus according to an exemplary embodiment of the present inventive concept will be described.

FIG. 9 is a longitudinal sectional view of a semiconductor memory manufacturing apparatus according to an exemplary embodiment of the present inventive concept. FIG. 10 is a plan view of a semiconductor wafer deposited by the semiconductor memory manufacturing apparatus according to an exemplary embodiment of the present inventive concept. FIG. 11A is a plan view of a shielding plate of FIG. 9, FIG. 11B is an enlarged view of area A of FIG. 11A, and FIG. 11C is a longitudinal sectional view taken along line B-B of FIG. 11B. FIG. 12 is a top view illustrating a shielding plate after the semiconductor wafer of FIG. 10 is mounted on a wafer holder. FIG. 13A is a plan view of a shielding plate according to an exemplary embodiment of the present inventive concept, and FIG. 13B is an enlarged view of area C of FIG. 13A. FIG. 14 is a partial longitudinal sectional view illustrating an operation of the shielding plate of the semiconductor memory manufacturing apparatus of FIG. 9.

Referring to FIGS. 9 to 12, a semiconductor memory manufacturing apparatus 10 includes a process chamber 11, a wafer holder 13, sputtering target holders 15, and a shielding plate 17.

The semiconductor memory manufacturing apparatus 10 may be used for manufacturing a semiconductor memory device including a magnetoresistive cell. The semiconductor memory manufacturing apparatus 10 may be used for depositing any deposition layer of magnetoresistive cells (or MTJs), which are located in different areas in one semiconductor memory device (or one semiconductor memory chip), to simultaneously have different thicknesses in the different areas. The semiconductor memory manufacturing apparatus 10 may form any deposition layer of magnetoresistive cells, which are located at different areas, to simultaneously have different thicknesses in the different areas by one process. Meanwhile, the semiconductor memory manufacturing apparatus 10 may be used in a process of locally depositing a deposition layer having a relatively small thickness to have a different thickness in addition to the semiconductor memory device including the magnetoresistive cell.

Referring to FIG. 10, in a semiconductor wafer 1 used in the semiconductor memory manufacturing apparatus 10, a plurality of semiconductor memory devices 100, which are arranged in a first direction y and spaced apart from each other in a second direction x, may be formed. Each of the semiconductor memory devices 100 may include a first memory area 100 a and a second memory area 100 b. The first memory area 100 a in plural may be arranged in a straight line in the first direction y, and the second memory area 100 b in plural may be spaced apart from the first memory areas 100 a in the second direction x and arranged in a straight line in the first direction y. The first memory area 100 a in plural may be spaced apart from each other in the second direction x while forming a rectangular shape which extends in the first direction y in the semiconductor wafer 1. The second memory area 100 b in plural may be alternately located with the first memory areas 100 a while forming a rectangular shape which extends in the first direction y in the semiconductor wafer 1.

The process chamber 11 has a hollow inside to accommodate the wafer holder 13, the sputtering target holders 15, and the shielding plate 17. An inert gas, such as argon (Ar) gas, may be supplied into the process chamber 11. The process chamber 11 may be formed as a process chamber of a sputtering process.

The wafer holder 13 includes a holder body 13 a, a body support 13 b and a supporting bar 13 c. The wafer holder 13 is located at a lower side of the inside of the process chamber 11 to support the semiconductor wafer 1 mounted on an upper surface thereof. The wafer holder 13 may be rotated by a separate rotating unit (not illustrated).

The holder body 13 a is formed to have an area larger than an area of the semiconductor wafer 1. The holder body 13 a may hold and support the semiconductor wafer 1 on the upper surface thereof.

The body support 13 b is connected to a lower portion of the holder body 13 a to support the holder body 13 a. The body support 13 b may adjust the height of the holder body 13 a to a predetermined height inside the process chamber 11. For example, the holder body 13 may be raised or lowered by raising or lowering the body support 13 b. The body support 13 b may be connected to a separate rotating unit (not illustrated) and rotated, and thus the holder body 13 a may be rotated.

The supporting bar 13 c has a bar shape having a predetermined length. The supporting bar 13 c is connected to the holder body 13 a at an outer circumferential surface of the holder body 13 a. The supporting bar 13 c supports the shielding plate 17 located on the wafer holder 13.

A plurality of sputtering targets held by a plurality of sputtering target holders 15 are provided and spaced apart from each other in a circumferential direction with respect to the semiconductor wafer 1. The sputtering target holders 15 are located so that target surfaces thereof face the semiconductor wafer 1. Each of the sputtering target holders 15 is inclined at a predetermined inclination angle θ with respect to a plane of the semiconductor wafer 1. The sputtering target holders 15 may hold sputtering targets for a sputtering process. The inclination angle θ of each of the sputtering target holders 15 may be appropriately determined in consideration of a diameter of the semiconductor wafer 1, a distance between each of the sputtering target holders 15 and the semiconductor wafer 1, a thickness of a deposition layer to be formed, and the like. Therefore, sputtered particles generated by sputtering the sputtering targets held by the sputtering target holders 15 may be incident on an upper surface of the semiconductor wafer 1 in an inclined direction. The sputtering target may be formed of a material corresponding to any one of a plurality of deposition layers constituting a magnetoresistive cell of a semiconductor memory device. For example, the sputtering target may be formed of a material constituting a fixed layer, a tunnel barrier layer, or a free layer.

The shielding plate 17 includes a shielding frame 17 a and shielding bars 17 b. The shielding plate 17 includes a first exposure area 18 a and a second exposure area 18 b. The first exposure area 18 a is an area in which one first exposure hole 19 a is formed to vertically pass through the entire area, and the second exposure area 18 b is an area in which a plurality of second exposure holes 19 b are formed to vertically pass through the entire area. The first exposure hole 19 a and the second exposure holes 19 b provide paths through which sputtered particles pass in a sputtering process. The first exposure area 18 a may be larger than the second exposure area 18 b. For example, the first exposure area 18 a may be formed to have an exposure area per unit area larger than that of the second exposure area 18 b. Here, the exposure area may refer to an area of the first exposure hole 19 a or the second exposure hole 19 b. The exposure area per unit area may refer to a ratio of a total area of each of the first exposure hole 19 a and the second exposure holes 19 b to a total area of each of the first exposure area 18 a and the second exposure area 18 b. The exposure area per unit area may refer to a ratio of an area through which sputtered particles pass to a total area.

The first exposure area 18 a is an area located on a deposition layer to be formed to have a first thickness, and the second exposure area 18 b is an area located on a deposition layer to be formed to have a second thickness smaller than the first thickness. For example, when the shielding plate 17 is used in the process of manufacturing the semiconductor memory device according to the exemplary embodiment of FIG. 1, the first exposure area 18 a is located on the first memory area 100 a and the second exposure area 18 b is located on the second memory area 100 b. Since the first exposure area 18 a has a large exposure area per unit area, the first exposure area 18 a may expose a relatively large area of the first memory area 100 a. Since the second exposure area 18 b has a small exposure area per unit area, the second exposure area 18 b may expose a small area of the second memory area.

The shielding plate 17 is located on the wafer holder 13 to be spaced apart from the upper surface of the semiconductor wafer 1. The shielding plate 17 may be coupled to the supporting bar 13 c of the wafer holder 13 and may rotate with the wafer holder 13. The sputtered particles may pass through the second exposure holes 19 b. For example, the sputtered particles may be obliquely incident on the upper surface of the shielding plate 17, pass through the second exposure holes 19 b, and be deposited on the semiconductor wafer 1. Further, since the shielding plate 17 rotates with the wafer holder 13 and the semiconductor wafer 1, an angle at which the sputtered particles pass through the second exposure holes 19 b may be continuously changed. Therefore, the sputtered particles may be uniformly deposited on each of the first memory area 100 a located below the first exposure area 18 a and the second memory area 100 b located below the second exposure area 18 b. The deposition layer may be deposited on the first memory area 100 a and the second memory area 100 b to have different thicknesses due to the effect of the first exposure hole 19 a and the second exposure holes 19 b. Since the second memory area 100 b is partially shielded by the second exposure holes 19 b, the deposition layer deposited on the second memory area 100 b may be deposited to have a relatively thinner thickness than the deposition layer deposited on the first memory area 100 a.

The shielding plate 17 may be spaced a separation height of 0.5 cm to 1.0 cm from the upper surface of the semiconductor wafer 1. For example, the shielding plate 17 may be distant from the upper surface of the semiconductor wafer 1 at a distance between 0.5 cm to 1.0 cm. The separation height of the shielding plate 17 may affect a deposition thickness of the area in which the sputtered particles are deposited, a deposition thickness of the deposition layer, and a deviation between the deposition thicknesses. The separation height may be controlled in consideration of a size of the second exposure hole 19 b, a separation distance between the second exposure holes 19 b, or the like. When the separation height is too low, the sputtered particles may be mainly deposited in an area immediately below the second exposure hole 19 b, and the deposition thickness may be increased. When the separation height is too low, a difference between a deposition thickness of an area under the second exposure holes 19 b in the second exposure area 18 b and a deposition thickness of an area away from the second exposure holes 19 b may be increased. When the separation height is too high, the sputtered particles passing through each of the first exposure hole 19 a and the second exposure holes 19 b may be deposited on each of the second exposure area 18 b and the first exposure area 18 a adjacent thereto or another area. Therefore, the difference between a deposition thickness of the area under the second exposure holes 19 b in the second exposure area 18 b and the deposition thickness of the area away from the second exposure holes 19 b may be reduced. In an exemplary embodiment, a width of each of the shielding bars 17 b, a separation distance between two adjacent shielding bars of the shielding bars 17 b, or a separation height of the shielding plate 17 from an upper surface of the semiconductor wafer 1 may be controlled such that a deposition layer to be deposited on the semiconductor wafer 1 has a predetermined thickness.

The shielding frame 17 a has a ring shape, and the first exposure area 18 a and the second exposure areas 18 b are located at an inside of the shielding frame 17 a. The present inventive concept is not limited thereto. For example, the shielding frame 17 a may have a shape of a rectangular ring, a hexagonal ring, or the like according to a shape of the substrate. The shielding frame 17 a may be formed so that an inside area thereof has an area larger than that of the semiconductor wafer 1 on which a sputtering process is performed. For example, the shielding plate 17 may be formed to have an inner diameter or a width greater than a diameter of the semiconductor wafer 1.

The shielding bar 17 b has a bar shape having a predetermined thickness. A shape of the shielding bar 17 b perpendicular to its longitudinal direction may be a rectangular shape. The shielding bar 17 b in plural may extend in a first direction y in the second exposure area 18 b and may be spaced apart from each other in a second direction x. For example, the shielding bar 17 b may be located to have a stripe shape or a line shape. In this case, the second exposure holes 19 b may extend in the first direction y, may be spaced apart from each other in the second direction x, and may be formed to have a rectangular shape having a length corresponding to a length of the shielding bar 17 b. The second exposure holes 19 b may be located to have a line shape which extends in the first direction y and may be spaced apart from each other in the second direction x. A thickness of the deposited deposition layer in the second memory area 100 b located below the second exposure area 18 b may be adjusted according to a width w1 of the shielding bar 17 b, a separation distance w2 between two adjacent shielding bars of the shielding bar 17 b in plural, and a height d of the shielding plate 17 from the semiconductor wafer 1.

When the shielding bar 17 b is formed to have a rectangular bar shape, the shielding bar 17 b may be formed to have a width of 5 μm to 50 μm. When the shielding bar 17 b is formed to have a circular bar shape, the shielding bar 17 b may be formed to have a diameter of 5 μm to 50 μm. When the width w1 or the diameter of the shielding bar 17 b is too small, strength thereof may be reduced and it may be difficult to uniformly form the second exposure holes 19 b. When the width w1 or the diameter of the shielding bar 17 b is too large, a size of each of the second exposure holes 19 b through which the sputtered particles pass may be reduced and it may be difficult to secure a required thickness of the deposition layer. The separation distance w2 of the shielding bar 17 b in plural may be 50 μm to 500 μm. When the separation distance w2 of the shielding bar 17 b in plural is too small, the size of the second exposure hole 19 b may be reduced and it may be difficult to secure a required deposition thickness of the deposition layer. Further, the difference between the deposition thickness of the area under the second exposure holes 19 b in the second exposure area 18 b and the deposition thickness of the area away from the second exposure holes 19 b may be increased. When the separation distance w2 of the shielding bars 17 b is too large, the number of the shielding bar 17 b in plural which may be located in the second exposure area 18 b may be significantly reduced. Therefore, when the separation distance w2 of the shielding bars 17 b is too large, it may be difficult to control the deposition thickness of the deposition layer.

According to an exemplary embodiment, referring to FIGS. 13A and 13B, a shielding plate 27 includes a shielding frame 17 a, first shielding bars 27 c, and second shielding bars 27 d. The shielding plate 27 includes a first exposure area 28 a and a second exposure area 28 b. The first exposure area 28 a is an area in which a first exposure hole 29 a is formed, and the second exposure area 28 b is an area in which second exposure holes 29 b are formed. The first shielding bars 27 c extend in a second direction x and are spaced apart from each other in a first direction y. The second shielding bars 27 d extend in the first direction y and are spaced apart from each other in the second direction x. The first shielding bars 27 c and the second shielding bars 27 d are located to form a grid shape. The second exposure holes 29 b of the shielding plate 27 have a rectangular shape, and are arranged to have a grid shape spaced apart from each other in the first direction y and the second direction x. Each of the first shielding bars 27 c and the second shielding bars 27 d may be formed to have the same width or the same separation distance as that of each of the shielding bars 17 b of FIGS. 11A to 11C. Each of the first shielding bars 27 c and the second shielding bars 27 d may be formed to have a width of 5 μm to 50 μm. The first shielding bars 27 c may be spaced apart from each other at a separation distance of 50 μm to 500 μm. The second shielding bars 27 d may be spaced apart from each other at a separation distance of 50 μm to 500 μm. The shielding plate 27 may reduce the thickness of the deposition layer deposited on the second memory area 100 b because an area shielded in the second exposure areas 28 b relatively increases compared to the shielding plate 17 of FIG. 11B.

Referring to FIG. 14, in the semiconductor memory manufacturing apparatus 10 according to the present inventive concept, a deposition thickness of the deposition layer 1 a deposited on the first memory area 100 a located below the first exposure areas 18 a and a deposition thickness of the deposition layer 1 b deposited on the second memory area 100 b located below the second exposure areas 18 b may be different from each other. The semiconductor memory manufacturing apparatus 10 may deposit the deposition layers so that the deposition thickness of the deposition layer 1 a deposited on the first memory area 100 a is greater than the deposition thickness of the deposition layer 1 b deposited on the second memory area 100 b.

In the semiconductor memory manufacturing apparatus 10, the sputtered particles from the sputtering targets held by the sputtering target holders 15 may pass through a first exposure hole 19 a of the first exposure area 18 a and second exposure holes 19 b of the second exposure area 18 b while being obliquely incident on the upper surface of the shielding plate 17, and may be deposited on the upper surface of the semiconductor wafer 1. Since the first exposure area 18 a includes one first exposure hole 19 a, the sputtered particles incident on the first exposure area 18 a may be uniformly deposited on the first memory area 100 a. Since the second exposure area 18 b includes the second exposure holes 19 b divided by shielding bars 17 b, some of the sputtered particles incident on the second exposure area 18 b may pass through the second exposure holes 19 b and may be deposited on the second memory area 100 b, and some of the sputtered particles may be deposited on the upper surface of the shielding bars 17 b. Since a relatively small amount of the sputtered particles is deposited on the second memory area 100 b, the deposition thickness of a deposition layer 1 b in the second memory area 100 b may be thinner than that of a deposition layer 1 a in the first memory area 100 a.

Since the sputtered particles are obliquely incident on the upper surface of the shielding plate 17, the sputtered particles may obliquely pass through the second exposure holes 19 b. The sputtered particles may be deposited on a portion of the second memory area 100 b under the second exposure hole 19 b and a portion of the second memory area 100 b under the shielding bar 17 b. Further, since the shielding plate 17 and the semiconductor wafer 1 constantly rotate during the sputtering process, the sputtered particles may be uniformly deposited on the entire area of the second memory area 100 b. When the shielding plate 17 and the semiconductor wafer 1 are located at predetermined positions, the sputtered particles (illustrated by solid lines) may be obliquely incident thereon from an upper right side to a lower left side and deposited thereon. When the shielding plate 17 and the semiconductor wafer 1 rotate, the sputtered particles (illustrated by dotted lines) may be obliquely incident thereon from an upper left side to a lower right side and deposited thereon. Therefore, in the second memory area 100 b, the sputtered particles may be uniformly incident on the lower portion of the shielding bar 17 b and deposited thereon.

According to an exemplary embodiment of the present inventive concept, memory devices having different characteristics may be formed in one semiconductor memory device by one process.

According to an exemplary embodiment of the present inventive concept, a memory device having a high retention characteristic and a memory device having a high operating speed may be formed in one semiconductor memory device by one process.

While the present inventive concept has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the inventive concept as defined by the following claims. 

What is claimed is:
 1. A semiconductor memory manufacturing apparatus comprising: a wafer holder configured to support a semiconductor wafer; a sputtering target holder obliquely located above the wafer holder; and a shielding plate interposed between the sputtering target holder and the wafer holder, wherein the shielding plate includes a first exposure area and a second exposure area, wherein the first exposure area is larger than the second exposure area, and wherein the shielding plate is spaced apart from the sputtering target holder and is disposed closer to the wafer holder than the sputtering target holder.
 2. The semiconductor memory manufacturing apparatus of claim 1, wherein the shielding plate includes a first exposure hole in the first exposure area and a plurality of second exposure holes in the second exposure area.
 3. The semiconductor memory manufacturing apparatus of claim 2, wherein: the shielding plate includes a plurality of shielding bars in the second exposure area; the plurality of shielding bars are extended in a first direction and are spaced apart from each other in a second direction; and the plurality of second exposure holes that are divided by the plurality of shielding bars are arranged in a line shape which extends in the first direction and are spaced apart from each other in the second direction.
 4. The semiconductor memory manufacturing apparatus of claim 3, wherein a width of each of the plurality of shielding bars, a separation distance between two adjacent shielding bars of the plurality of shielding bars, or a separation height of the shielding plate from an upper surface of the semiconductor wafer are controlled such that a deposition layer to be deposited on the semiconductor wafer has a predetermined thickness.
 5. The semiconductor memory manufacturing apparatus of claim 3, wherein each of the plurality of shielding bars has a width between 5 μm and 50 μm.
 6. The semiconductor memory manufacturing apparatus of claim 3, wherein two adjacent shielding bars of the plurality of shielding bars are separated at a distance between 50 μm and 500 μm.
 7. The semiconductor memory manufacturing apparatus of claim 3, wherein the shielding plate is distant from an upper surface of the semiconductor wafer at a distance between 0.5 cm to 1.0 cm.
 8. The semiconductor memory manufacturing apparatus of claim 2, wherein the second exposure area includes: a plurality of first shielding bars extended in a first direction and spaced apart from each other in a second direction; and a plurality of second shielding bars extended in the second direction and spaced apart from each other in the first direction, and wherein the plurality of first shielding bars and the plurality of second shielding bars are connected to each other to form a grid shape having the plurality of second exposure holes each of which has a rectangular shape.
 9. The semiconductor memory manufacturing apparatus of claim 1, wherein the shielding plate is configured to rotate.
 10. A semiconductor memory manufacturing apparatus comprising: a wafer holder configured to support a semiconductor wafer including a first memory area and a second memory area; a sputtering target holder obliquely located above the wafer holder; and a shielding plate interposed between the sputtering target holder and the wafer holder, wherein the shielding plate includes a first exposure area located above the first memory area, and a second exposure area located above the second memory area, wherein the first exposure area is larger than the second exposure area, wherein a first memory device is located in the first memory area, wherein a second memory device is located in the second memory area, and wherein the shielding plate is spaced apart from the sputtering target holder and is disposed closer to the wafer holder than the sputtering target holder.
 11. The semiconductor memory manufacturing apparatus of claim 10, wherein the first memory device operates with smaller energy, and higher speed than the second memory device.
 12. The semiconductor memory manufacturing apparatus of claim 11, wherein the first memory device is formed as SRAM or DRAM, and wherein the second memory device is formed as flash memory.
 13. The semiconductor memory manufacturing apparatus of claim 10, wherein the first memory device includes a first magnetoresistive cell, and wherein the second memory device includes a second magnetoresistive cell.
 14. The semiconductor memory manufacturing apparatus of claim 13, wherein each magnetoresistive cell includes a fixed layer, a tunnel barrier layer, a free layer, and a capping layer, wherein the fixed layer, the tunnel barrier layer, and the free layer form a magnetic tunnel junction (MTJ).
 15. The semiconductor memory manufacturing apparatus of claim 14, wherein a thickness of the capping layer of the second magnetoresistive cell is thinner than a thickness of the capping layer of the first magnetoresistive cell.
 16. The semiconductor memory manufacturing apparatus of claim 14, wherein a first layer of a plurality of layers of the first magnetoresistive cell has a substantially uniform thickness, wherein a second layer which corresponding to the first layer of the plurality of layers of the second magnetoresistive cell has a substantially uniform thickness, and wherein the thickness of the second layer is thinner than the thickness of the first layer.
 17. The semiconductor memory manufacturing apparatus of claim 10, wherein the shielding plate includes a plurality of shielding bars in the second exposed area, and wherein a width of each shielding bar is smaller than a separation distance between the plurality of shielding bars.
 18. The semiconductor memory manufacturing apparatus of claim 17, wherein each shielding bar has a shape extending in one direction.
 19. The semiconductor memory manufacturing apparatus of claim 17, wherein the shielding plate further includes a shielding frame which surrounds the outside of the plurality of shielding bars, and has ring shape, and wherein an inner region of the shielding frame has an area larger than that of the semiconductor wafer.
 20. A semiconductor memory manufacturing apparatus comprising: a process chamber in which a sputtering process is performed; a wafer holder located inside the process chamber and configured to support and rotate a semiconductor wafer including a first memory area and a second memory area; a sputtering target obliquely located above the semiconductor wafer inside the process chamber so that sputtering particles are obliquely incident on an upper surface of the semiconductor wafer during the sputtering process; and a shielding plate fixed to an upper portion of the wafer holder, configured to rotate with the wafer holder, and including a plurality of first exposure areas and second exposure areas, wherein the first exposure areas are located on the first memory area, the second exposure areas are located on the second memory area, and each of the first exposure areas has an exposure area per unit area larger than that of each of the second exposure areas, wherein each of the first exposure areas includes a first exposure hole to vertically pass through an entire area thereof, and wherein each of the second exposure areas includes a plurality of second exposure holes to vertically pass therethrough. 